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HA, HA-V2 foil crystal structure and excellent various properties
HA and HA-V2 foils are high performance calendered copper foils with excellent bending characteristics (static bending characteristics), sliding buckling characteristics (dynamic bending characteristics), low resilience, softness and vibration resistance by increasing grain size and keeping crystal direction consistent. The grain boundary area, which is the origin point of crack, can be reduced and the crack occurrence can be inhibited by making the grain grow larger after annealing.
HA and HA-V2 foils have higher sliding buckling characteristics than ordinary calendered copper foils. In addition, by providing an extremely thin 9µm copper foil, further miniaturization and thinness of electronic devices can be matched.
For repeated bending (= bending), HA foil has superior properties than ordinary calendered copper foil. After repeated bending test of FCCL at 180 degree , cracks appeared in the special electrolytic copper foil in the second cycle, and TPC foil, HA-V2 foil and HA foil did not appear in the second, fifth and sixth cycles, respectively. Compared with special electrolytic copper foils, HA foils, HA-V2 foils and TPC foils have higher bending advantages.
The vibration resistance of FCCL with HA foil at room temperature is about 2 times that of ordinary calended copper foil. It has about 5 times the life of ordinary rolled copper foil at high temperatures (115 degree C), and 3 times the life of thermal cycle tests at -30-115 degree C, maintaining excellent vibration resistance even under harsh conditions.
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